schottky die 200 x 200 mils (monolithic dual) SC202.....5.. series 1 bulletin i0508j rev. b 05/01 not to scale 40 (157) notes: 1. all dimensions are shown in millimeters (mils). 2. controlling dimension: (mils). 3. dimensions and tolerances: a = 5.08 + 0, - 0.01 (200 + 0, - 0.4) b = 5.08 + 0, - 0.01 (200 + 0, - 0.4) c = 4.92 + 0, - 0.01 (193 + 0, - 0.4) d = 2.43 + 0, - 0.01 (95 + 0, - 0.4) ? = 1 0.15 (40 6) 4. letter designation: a = anode (top metal) c = cathode (back metal) d = reject ink dot (only on non-conforming dies) 5. sawing: recommended blade semitec s1025 qs00 blade sawing street 0.05 + 0, - 0.005 (2 + 0, - 0.2) wafer flat alligned with side b of the die (10 0.4) b c anode a d anode 0.25 0.01 ? d
SC202.....5. series 2 preliminary data sheet i0508j rev. a 07/00 SC202 s 020a5 150 20 8 0.42 v @ 40a per die, t j = 25c SC202 s 030a5 150 30 2 0.46v @ 30a per die, t j = 25c SC202 s 045a5 150 45 2 0.51 v @ 20a per die, t j = 25c SC202 s 060a5 150 60 2 0.54v @ 15a per die, t j = 25c SC202 h 100a5 150 100 0.55 0.69 v @ 10a per die, t j = 25c SC202....5 b . inked probed unsawn wafer (wafer in box) 48 device t j max. v r max. i r @ 25c (*) max. v f @ i f # (c) (v) (ma) (v) electrical characteristics device metal thickness metal thickness # front metal back metal SC202.... a 5.. bondable -- al/si 30 k? -- ti 1 k? ni 4 k? ag 6 k? mechanical data device description minimum order quantity # wafer in sale package packaging visual inspection : see ir internal spec. # 6373-2064 recommended storage environment: store in original container, in dessicated nitrogen, with no contamination. shelf life for parts stored in above condition is 2 years. if the storage is done in normal atmosphere shelf life is reduced to six months. (*) for reference only, v f do not include voltage drop across wire bonding resistance
SC202.....5. series 3 preliminary data sheet i0508j rev. a 07/00 sc 202 s 060 a 5 b t 1 2 3 1 - schottky die 2 - chip dimension in mils: 200 x 200 dual monolithic 3 - process (see electrical characteristics table) 4 - voltage code: code = v rrm 5 - chip surface metallization (al) 6 - wafer diameter in inches 7 - packaging: b = inked probed unsawn wafers (in box) 8 - thickness (omitted if 14 mils, t for 10 mils die) 4 device code ordering information table 5 6 7 h = 830 process r = or' ing process s = standard process wafer in box round container foam disk tyvek disk 8
SC202.....5. series 4 preliminary data sheet i0508j rev. a 07/00 world headquarters: 233 kansas st., el segundo, california 90245 u.s.a. tel: (310) 322 3331. fax: (310) 322 3332. european headquarters: hurst green, oxted, surrey rh8 9bb, u.k. tel: ++ 44 1883 732020. fax: ++ 44 1883 733408. ir canada: 15 lincoln court, brampton, markham, ontario l6t3z2. tel: (905) 453 2200. fax: (905) 475 8801. ir germany: saalburgstrasse 157, 61350 bad homburg. tel: ++ 49 6172 96590. fax: ++ 49 6172 965933. ir italy: via liguria 49, 10071 borgaro, torino. tel: ++ 39 11 4510111. fax: ++ 39 11 4510220. ir far east: k&h bldg., 2f, 30-4 nishi-ikebukuro 3-chome, toshima-ku, tokyo, japan 171. tel: 81 3 3983 0086. ir southeast asia: 1 kim seng promenade, great world city west tower,13-11, singapore 237994. tel: ++ 65 838 4630. ir taiwan: 16 fl. suite d.207, sec. 2, tun haw south road, taipei, 10673, taiwan. tel: 886 2 2377 9936. http://www.irf.com fax-on-demand: +44 1883 733420 data and specifications subject to change without notice.
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